DocumentCode
2023771
Title
Enabling new LED designs through advanced cooling technology
Author
Noska, Brandon ; Che Cheung ; Jin, Hye-Jin ; Mahalingam, Raghav
Author_Institution
Nuventix Inc., Austin, TX, USA
fYear
2010
fDate
21-25 Feb. 2010
Firstpage
305
Lastpage
310
Abstract
Light Emitting Diodes (LEDs) are increasingly being designed into lighting products for general illumination and are now gaining traction in the market. Several LED products are already available, but have generally been accepted only for low light level applications because of the low lumen output and poor quality of light for many of the products. Much of the reason for the low lumen output is the limited cooling capacity of natural convection which is most commonly used. Unlike incandescent, halogen based, or other traditional lighting technologies, LEDs need proper thermal management to increase the lumen output, maintain quality of light and ensure high reliability and useful life. This paper investigates synthetic jet technology as a viable option for forced convection cooling as an alternative for natural convection in LED products to enable higher lumen designs without compromising form factor, quality of light and reliability.
Keywords
cooling; forced convection; jets; light emitting diodes; lighting; semiconductor device packaging; thermal management (packaging); LED designs; advanced cooling technology; cooling capacity; forced convection cooling; form factor; general illumination; halogen based technology; incandescent technology; light emitting diodes; light quality; lighting products; low light level applications; low lumen output; lumen designs; natural convection; synthetic jet technology; thermal management; Cooling; Decision support systems; Light emitting diodes; Advanced Cooling; High Reliability; LED; Light Emitting Diode; Natural Convection; SSL; Solid State Lighting; Synthetic Jet; Thermal Management;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM 2010. 26th Annual IEEE
Conference_Location
Santa Clara, CA
ISSN
1065-2221
Print_ISBN
978-1-4244-9458-3
Electronic_ISBN
1065-2221
Type
conf
DOI
10.1109/STHERM.2010.5444275
Filename
5444275
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