DocumentCode
2023922
Title
IC compatible MEMS technology
Author
Grenier, K. ; Mazenq, L. ; Dubuc, D. ; Bouchriha, F. ; Coccetti, F. ; Ojefors, E. ; Eindberg, P. ; Rydberg, A. ; Berntgen, J. ; Rabe, W.J. ; Sonmez, E. ; Abele, P. ; Schumacher, H. ; Plana, R.
Author_Institution
LAAS-CNRS, Toulouse, France
fYear
2005
fDate
3-4 Oct. 2005
Firstpage
293
Lastpage
296
Abstract
This paper deals with an integrated circuits (ICs) compatible MEMS technology, which is used to elaborate an ultra compact RF communication module centered at 24 GHz. This technology uses conventional equipment and is adequate for millimeter wave applications. A compatibility test protocol has consequently been defined in order to check that each technological step does not degrade the SiGe circuits´ performances. Finally, the realized demonstrator present a total surface of only 9 mm/sup 2/.
Keywords
micromechanical devices; microwave integrated circuits; 24 GHz; IC compatible MEMS technology; compatibility test protocol; integrated circuits; ultra compact RF communication module; Circuit testing; Degradation; Integrated circuit technology; Micromechanical devices; Millimeter wave communication; Millimeter wave integrated circuits; Millimeter wave technology; Protocols; Radio frequency; Radiofrequency integrated circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Gallium Arsenide and Other Semiconductor Application Symposium, 2005. EGAAS 2005. European
Conference_Location
Paris
Print_ISBN
88-902012-0-7
Type
conf
Filename
1637208
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