A low-cost high performance GaAs MMIC package using air-cavity ceramic quad flat non-leaded package up to 40 GHz

Author

Suh, Young-Ho ; Richardson, David ; Dadello, Anna ; Mahon, Simon ; Harvey, James T.

Author_Institution

Mimix Broadband Inc., Houston, TX, USA

fYear

2005

fDate

3-4 Oct. 2005

Firstpage

545

Lastpage

548

Abstract

A novel low-cost QFN (quad flat non-leaded) package is introduced for GaAs MMIC packaging. The air-cavity QFN package is designed and implemented with an HTCC process using alumina substrate. To operate the package up to 40 GHz, several key methods are proposed in this paper. A low noise and a buffer amplifier are packaged for practical application examples and compared with bare die measurements to verify the QFN package performance. A maximum of 4.5 dB insertion loss degradation occurred at 40 GHz. To authors´ knowledge, this is the highest operating frequency for QFN type packages with low loss ever reported.

Keywords

III-V semiconductors; MIMIC; alumina; ceramic packaging; gallium arsenide; integrated circuit packaging; Al/sub 2/O/sub 3/; GaAs; MMIC package; air-cavity ceramic package; alumina substrate; buffer amplifier; low noise amplifier; quad flat nonleaded package; Ceramics; Costs; Dielectric constant; Dielectric materials; Gallium arsenide; MMICs; Organic materials; Plastic packaging; Production; Radio frequency;

fLanguage

English

Publisher

ieee

Conference_Titel

Gallium Arsenide and Other Semiconductor Application Symposium, 2005. EGAAS 2005. European

Conference_Location

Paris

Print_ISBN

88-902012-0-7

Type

conf

Filename

1637276