Title :
De-embedding procedures for characterization of interconnect and package discontinuities
Author_Institution :
Dept. of Electr. & Comput. Eng., Syracuse Univ., NY, USA
Abstract :
Many techniques exist for characterizing passive lossless devices utilizing a quasistatic approach. If modeled accurately, the quasistatic approaches can provide accurate results. De-embedding techniques for quasi-static solutions are not too complex. However, when radiation effects or higher order modes exist characterizing interconnects or discontinuities become a complex problem. The author presents the matrix pencil approach as a novel and accurate de-embedding procedure. In this method, the S-parameters are computed directly without requiring specific values for the characteristic impedance. This is because in this technique, the results are automatically normalized with respect to the characteristic impedance of the ports at the frequency of interest. Also, the lines need not be terminated in their characteristic impedance, z/sub 0/, to evaluate the S-parameters. This technique is particularly effective for open structures. Numerical results are presented to illustrate the various de-embedding procedures.
Keywords :
S-parameters; S-parameters; characteristic impedance; characterization method; deembedding procedures; higher order modes; interconnect discontinuities; matrix pencil method; open structures; package discontinuities; quasi-static solutions; radiation effects; Frequency; Impedance; Microstrip antennas; Packaging; Power transmission lines; Propagation losses; Radiation effects; Scattering parameters; Transmission line discontinuities; Transmission line matrix methods;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594132