Title :
1991 Proceedings. 41st Electronic Components and Technology Conference (Cat. No.91CH2989-2)
Abstract :
The following topics are dealt with: advanced inorganic materials and processes; optoelectronic packaging and passive devices; packaging modeling and characterization; hybrid applications and advanced substrates; single chip packaging; connectors; TAB (tape automated bonding) and wire interconnect; polyimides and other organic materials; solder material; packaging reliability; multichip modules; flip chip/solder reliability; and interconnect reliability. Abstracts of individual papers can be found under the relevant classification codes in this or other issues
Keywords :
hybrid integrated circuits; microassembling; monolithic integrated circuits; packaging; reliability; soldering; TAB; advanced substrates; connectors; flip chips; hybrid applications; inorganic materials; interconnect reliability; multichip modules; optoelectronic packaging; organic materials; package characterization; packaging modeling; packaging reliability; passive devices; polyimides; single chip packaging; solder material; solder reliability; tape automated bonding; wire interconnect;
Conference_Titel :
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location :
Atlanta, GA, USA
Print_ISBN :
0-7803-0012-2
DOI :
10.1109/ECTC.1991.163841
