Title :
IC package and interconnect characterization using enhanced accuracy time domain reflectometry
Author :
Smolyansky, DmiUtry A. ; Diamond, Scott K. ; Pepper, Steven H. ; Tripathi, Vijai K.
Author_Institution :
Test & Meas. Div., Tektronix Inc., OR, USA
Abstract :
A method of enhancing the accuracy of time domain reflectometry measurements is presented. This method is based on calibrating and filtering of the time domain data. The calibration is performed in frequency domain. The filtering is accomplished by launching an ideal excitation into the device under test. The rise time of this excitation is chosen so that the least amount of high frequency noise enters the system
Keywords :
time-domain reflectometry; IC package characterization; TDR measurements; calibration; enhanced accuracy reflectometry; filtering; interconnect characterization; time domain reflectometry; Computer errors; Filtering; Frequency domain analysis; Frequency measurement; Integrated circuit packaging; Noise measurement; Reflection; Sampling methods; Testing; Time measurement;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594134
