DocumentCode
2029960
Title
Performance and reliability of redundant thermoelectric coolers
Author
Huang, S.Y. ; Yanushefski, K.A.
Author_Institution
AT&T Bell Lab., Breinigsville, PA, USA
fYear
1991
fDate
11-16 May 1991
Firstpage
34
Lastpage
37
Abstract
The authors derived analytical solutions for thermoelectric coolers (TECs) with two-branch redundancy design, any number of open and short elements, and excess resistance. The model was used to predict the thermal performance of the TEC under high thermal load and compared with experimental data with good agreement. The inherent failure rate of both the series and two-branch redundant TECs were calculated. The latter was found to provide an approximately eight-times improvement in the expected failure rate. This improvement is necessary for a TEC to handle a high thermal load while meeting the reliability requirement of telecommunication systems
Keywords
cooling; optical communication equipment; packaging; redundancy; reliability; thermoelectric devices; TECs; analytical solutions; failure rate; high thermal load; reliability; telecommunication systems; thermal performance; thermoelectric coolers; two-branch redundancy design; Erbium-doped fiber lasers; Heat sinks; Laser excitation; Packaging; Predictive models; Pump lasers; Redundancy; Solid state circuits; Thermal loading; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location
Atlanta, GA
Print_ISBN
0-7803-0012-2
Type
conf
DOI
10.1109/ECTC.1991.163849
Filename
163849
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