• DocumentCode
    2029960
  • Title

    Performance and reliability of redundant thermoelectric coolers

  • Author

    Huang, S.Y. ; Yanushefski, K.A.

  • Author_Institution
    AT&T Bell Lab., Breinigsville, PA, USA
  • fYear
    1991
  • fDate
    11-16 May 1991
  • Firstpage
    34
  • Lastpage
    37
  • Abstract
    The authors derived analytical solutions for thermoelectric coolers (TECs) with two-branch redundancy design, any number of open and short elements, and excess resistance. The model was used to predict the thermal performance of the TEC under high thermal load and compared with experimental data with good agreement. The inherent failure rate of both the series and two-branch redundant TECs were calculated. The latter was found to provide an approximately eight-times improvement in the expected failure rate. This improvement is necessary for a TEC to handle a high thermal load while meeting the reliability requirement of telecommunication systems
  • Keywords
    cooling; optical communication equipment; packaging; redundancy; reliability; thermoelectric devices; TECs; analytical solutions; failure rate; high thermal load; reliability; telecommunication systems; thermal performance; thermoelectric coolers; two-branch redundancy design; Erbium-doped fiber lasers; Heat sinks; Laser excitation; Packaging; Predictive models; Pump lasers; Redundancy; Solid state circuits; Thermal loading; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1991. Proceedings., 41st
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    0-7803-0012-2
  • Type

    conf

  • DOI
    10.1109/ECTC.1991.163849
  • Filename
    163849