Title :
Table of contents
Abstract :
The following topics are dealt with: advanced metrology; lithography; advanced processes and materials; factory automation and factory dynamics; advanced process control; cleaning and surface preparation; defect inspection; human resources development; yield and productivity concerns; cost reduction, equipment reliability and productivity; yield enhancements and yield modeling
Keywords :
factory automation; human resource management; inspection; integrated circuit manufacture; integrated circuit yield; lithography; process control; semiconductor device manufacture; surface cleaning; advanced materials; advanced metrology; advanced processes; advanced semiconductor manufacturing; cleaning process; cost reduction; defect inspection; equipment productivity; equipment reliability; factory automation; factory dynamics; human resources development; lithography; process control; surface preparation; yield enhancement; yield modeling;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2006. ASMC 2006. The 17th Annual SEMI/IEEE
Conference_Location :
Boston, MA
Print_ISBN :
1-4244-0254-9
DOI :
10.1109/ASMC.2006.1638712
