Title :
Relationship between surface discharge of Polbuschel-type in an artificial void and pit formation
Author_Institution :
Nagoya Univ., Japan
Abstract :
In previous reports, pit formation in a micro-gap has been discussed using an artificial void model which has been made based on the Whitehead model. As a result, a difference in surface discharge patterns in the micro-gap was found to have an effect on pit formation processes. In this study, further details are investigated, especially when the surface discharge pattern is Polbuschel-type. The pit formation processes are classified into two different types: fatigue-failure-type degradation process at low voltage and random-failure-type degradation process at high voltage. At low voltage, the oxidation reaction probably leads to pit formation. To investigate the pit formation process at high voltage, local field strength around a tip of a surface discharge is calculated using an analysis model. The result suggests that a surface discharge of Polbuschel-type makes possible instantaneous breakdown of a polymer. Therefore, pit formation at high voltage is probably governed by a surface discharge causing instantaneous breakdown of the polymer.
Keywords :
oxidation; polymers; surface discharges; voids (solid); Polbfuchel-type surface discharge; Whitehead model; artificial void model; high voltage random-failure-type degradation; low voltage fatigue-failure-type degradation; micro-gap pit formation; oxidation reaction; partial discharge degradation; polymer bond scission; polymer breakdown; surface discharge patterns; surface discharge tip local field strength; Boolean functions; Breakdown voltage; Capacitors; Data structures; Electrodes; Partial discharges; Shape; Space charge; Surface discharges; Testing;
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2004. CEIDP '04. 2004 Annual Report Conference on
Print_ISBN :
0-7803-8584-5
DOI :
10.1109/CEIDP.2004.1364232