DocumentCode :
2032966
Title :
The effect of tape overlappings in winding insulations on tree growth and breakdown time
Author :
Vogelsang, R. ; Brütsch, R. ; Fröhlich, K.
Author_Institution :
High Voltage Lab., Swiss Fed. Inst. of Technol., Zurich, Switzerland
fYear :
2004
fDate :
17-20 Oct. 2004
Firstpage :
294
Lastpage :
297
Abstract :
The propagation of electrical trees in bent mica tapes of tape overlappings is described. The investigations were made because tapes in winding insulations of high voltage rotating machines are regularly bent at those sections. Geometrical sizes of bent mica tapes were analysed in micrographs and its influence on time to breakdown was determined in treeing experiments in a needle-plane-arrangement. It was found that a bent tape, which is penetrated by the tree, can lead to significantly reduced time to breakdown values. The probability of penetrating a tape depends on the size of bending and the support material. The results can be used by manufacturers to choose mica tapes that assure a higher quality of the insulation. Furthermore, the results provide a basis of developing tapes with lower sensitivity to damages at bends.
Keywords :
insulation testing; machine insulation; machine windings; mica; reliability; trees (electrical); Al2O3-K2O-SiO2; bent mica tapes; breakdown time; electrical tree propagation; geometrical sizes; high voltage rotating machines; insulation quality; micrographs; needle-plane-arrangement; penetrated tape probability; tape damage sensitivity; tape overlapping effects; time to breakdown; tree growth; treeing experiments; winding insulations; Circuit testing; Degradation; Dielectrics and electrical insulation; Electric breakdown; Machine windings; Needles; Resins; Rotating machines; Trees - insulation; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2004. CEIDP '04. 2004 Annual Report Conference on
Print_ISBN :
0-7803-8584-5
Type :
conf
DOI :
10.1109/CEIDP.2004.1364246
Filename :
1364246
Link To Document :
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