DocumentCode
2033041
Title
Electrical packaging impact on source components in optical interconnects
Author
Neifeld, M.A. ; Chou, Wu Cbun
Author_Institution
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
fYear
1994
fDate
2-4 Nov 1994
Firstpage
235
Lastpage
238
Abstract
A simulation study of optical interconnects is described. Influences of electrical packaging technologies on laser source performance is evaluated. Various laser and driver types are considered together with ceramic board, film carrier and flip-chip connections
Keywords
optical interconnections; ceramic board; driver types; electrical packaging technologies; film carrier; flip-chip connections; laser source; optical interconnects; simulation study; source components; Diode lasers; Driver circuits; Optical crosstalk; Optical fiber communication; Optical interconnections; Optical modulation; Optical noise; Optical receivers; Packaging; Semiconductor laser arrays;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location
Monterey, CA
Print_ISBN
0-7803-2411-0
Type
conf
DOI
10.1109/EPEP.1994.594157
Filename
594157
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