DocumentCode
2033280
Title
Yield Improvement Using Fail Signature Detection Algorithm (FSDA)
Author
Inani, Anand ; Burch, Richard ; Kim, Joseph ; Stine, Brian
Author_Institution
PDF Solutions Inc., San Jose, CA
fYear
2006
fDate
22-24 May 2006
Firstpage
225
Lastpage
227
Abstract
An effective yield ramp methodology is demonstrated using fail signature detection algorithm (FSDA). Wafers with similar yield spatial patterns are grouped together to find stronger correlations to equipment data. Many signals that would have been missed otherwise were found leading to significant yield improvement
Keywords
failure analysis; inspection; integrated circuit yield; fail signature detection algorithm; yield ramp methodology; yield spatial patterns; Clustering algorithms; Clustering methods; Detection algorithms; History; Logic; Manufacturing processes; Noise reduction; Probability; Semiconductor device manufacture; Signal analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference, 2006. ASMC 2006. The 17th Annual SEMI/IEEE
Conference_Location
Boston, MA
ISSN
1078-8743
Print_ISBN
1-4244-0254-9
Type
conf
DOI
10.1109/ASMC.2006.1638757
Filename
1638757
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