Title :
Brittle fracture behavior and interfacial reaction of Sn-Ag-Cu solders on ENIG and ENEPIG surface finish
Author :
Sang-Hyun Kwon ; Kang-Dong Kim ; Tae-Ho Lee ; Deok-Gon Han ; Tae-Hyun Sung ; Chang-Woo Lee ; Sehoon Yoo
Abstract :
Brittle fracture behavior of Sn-Ag-Cu solders on ENIG and ENEPIG surface finish were evaluated with varying the metal turn over (MTO) of the Ni(P) plating solution in this study. As the MTO increased, the shear strength of the solder joints decreased. Percentage of brittle fracture increased as the MTO of Ni(P) solution increased. The solder joints on ENIG surface finish showed higher brittle fracture rate than that on ENEPIG surface finish. From TEM observation, nano-voids were observed in the Ni-Sn-P layer and the amount of nano-voids increased as the MTO of Ni(P) plating solution increased.
Keywords :
brittle fracture; copper alloys; electroplating; shear strength; silver alloys; soldering; solders; surface finishing; tin alloys; ENEPIG surface finishing; ENIG surface finishing; MTO; Ni-Sn-P layer; Sn-Ag-Cu solders; SnAgCu; TEM observation; brittle fracture behavior; interfacial reaction; metal turn over; nanovoids; plating solution; shear strength; solder joints; Conferences; DH-HEMTs; Decision support systems; Electronics packaging;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-4553-8
Electronic_ISBN :
978-1-4673-4551-4
DOI :
10.1109/EPTC.2012.6507079
