Brittle fracture behavior and interfacial reaction of Sn-Ag-Cu solders on ENIG and ENEPIG surface finish

Author

Sang-Hyun Kwon ; Kang-Dong Kim ; Tae-Ho Lee ; Deok-Gon Han ; Tae-Hyun Sung ; Chang-Woo Lee ; Sehoon Yoo

fYear

2012

fDate

5-7 Dec. 2012

Firstpage

206

Lastpage

210

Abstract

Brittle fracture behavior of Sn-Ag-Cu solders on ENIG and ENEPIG surface finish were evaluated with varying the metal turn over (MTO) of the Ni(P) plating solution in this study. As the MTO increased, the shear strength of the solder joints decreased. Percentage of brittle fracture increased as the MTO of Ni(P) solution increased. The solder joints on ENIG surface finish showed higher brittle fracture rate than that on ENEPIG surface finish. From TEM observation, nano-voids were observed in the Ni-Sn-P layer and the amount of nano-voids increased as the MTO of Ni(P) plating solution increased.

Keywords

brittle fracture; copper alloys; electroplating; shear strength; silver alloys; soldering; solders; surface finishing; tin alloys; ENEPIG surface finishing; ENIG surface finishing; MTO; Ni-Sn-P layer; Sn-Ag-Cu solders; SnAgCu; TEM observation; brittle fracture behavior; interfacial reaction; metal turn over; nanovoids; plating solution; shear strength; solder joints; Conferences; DH-HEMTs; Decision support systems; Electronics packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th

Conference_Location

Singapore

Print_ISBN

978-1-4673-4553-8

Electronic_ISBN

978-1-4673-4551-4

Type

conf

DOI

10.1109/EPTC.2012.6507079

Filename

6507079