DocumentCode
2033351
Title
Clean Dicing of Compound Semiconductors Using the Water-Jet Guided Laser Technology
Author
Perrottet, Delphine ; Green, Sean ; Richerzhagen, Bernold
Author_Institution
Synova SA, Ecublens
fYear
2006
fDate
22-24 May 2006
Firstpage
233
Lastpage
236
Abstract
The water-jet-guided laser is a new technology for micro machining that combines a laser beam into a hair-thin, low-pressure water jet for wafer dicing. In addition to silicon, it can dice compound semiconductors such as GaAs, InP and SiC without damage
Keywords
laser beam cutting; micromachining; water jet cutting; clean dicing; compound semiconductors; low-pressure water jet; micromachining; wafer dicing; water-jet guided laser; Abrasives; Contamination; Gallium arsenide; Laser beam cutting; Optical materials; Semiconductor lasers; Semiconductor materials; Surface emitting lasers; Water jet cutting; Water pollution;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference, 2006. ASMC 2006. The 17th Annual SEMI/IEEE
Conference_Location
Boston, MA
ISSN
1078-8743
Print_ISBN
1-4244-0254-9
Type
conf
DOI
10.1109/ASMC.2006.1638759
Filename
1638759
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