DocumentCode :
2033636
Title :
Stress analysis of metal seal ring AlN packages
Author :
Jones, W.K. ; Jiang, W. ; Harshbarger, R.W. ; Zhuge, R.
Author_Institution :
Dept. of Mech. Eng., Florida Int. Univ., Miami, FL, USA
fYear :
1991
fDate :
11-16 May 1991
Firstpage :
203
Lastpage :
209
Abstract :
The static response of the molybdenum/AlN seal ring structure, subjected to uniform cooling (or heating), is evaluated by finite-element analysis, and results are compared with those of the widely used Kovar/Al2O3 combination. Results have shown that within the main portion of the seal ring structure (0⩽x⩽0.85l), shear stress and transverse stress are close to zero and can be neglected when compared to the level of longitudinal stress. However, near the ends, the shear stress and transverse stress can no longer be neglected, and the complicated stress distribution at the end area has far exceeded the results of classical bending theory, especially for the non-zero transverse stress
Keywords :
aluminium compounds; cooling; finite element analysis; molybdenum; packaging; stress analysis; Mo-AlN; finite-element analysis; metal seal ring; shear stress; static response; stress analysis; transverse stress; uniform cooling; Ceramics; Electronic packaging thermal management; Multichip modules; Seals; Semiconductor device packaging; Silicon; Thermal conductivity; Thermal expansion; Thermal stresses; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-0012-2
Type :
conf
DOI :
10.1109/ECTC.1991.163877
Filename :
163877
Link To Document :
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