DocumentCode
2034491
Title
I/O options for MCNC multichip package
Author
Koopman, Nicholas G.
Author_Institution
MCNC Center for Microelectron., Research Triangle Park, NC, USA
fYear
1991
fDate
11-16 May 1991
Firstpage
234
Lastpage
244
Abstract
A strategy for signal and power connections to the MCNC multichip module is formulated. The module structure is described in detail. System trends and scaling theory are used to define requirements for three generations of multichip module technology extending to the year 2000. The state of the art of computer manufacturers and development activities of connector vendors is discussed. Pin, pinless, and flexible circuit technologies are described, with specific combinations of technologies being fitted to the MCNC substrate. The intent is to generate a menu of compatible technologies and applications
Keywords
hybrid integrated circuits; packaging; MCNC multichip package; compatible technologies; flexible circuit technologies; multichip module; power connections; scaling theory; signal connections; Aging; Computer aided manufacturing; Cooling; Costs; Integrated circuit interconnections; Integrated circuit technology; Microelectronics; Multichip modules; National electric code; Packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location
Atlanta, GA
Print_ISBN
0-7803-0012-2
Type
conf
DOI
10.1109/ECTC.1991.163882
Filename
163882
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