2L OMEDFC development for low cost & high performance application

The development of a 2L overmolded exposed die flip chip package is summarized in this paper. The development consisted of first completing extensive thermal & mechanical modeling for optimized package thermal & warpage performance. The modeling results were used to define manufacturing requirements including the bill of materials. Because the die were exposed, a process and BOM that balanced between pressure needed to insure minimal back side die flash while at the same time not causing low k damage had to be developed. Further, because the die to package ratio was <; 0.1, package warpage of <; 100um thick core substrate was also very difficult to obtain. Using the modeling results as a guide, the mold chase design, BOM, and process parameters were optimized in such a way as to provide a means to produce the package. After initial development and full characterization of the optimized process, mold chase design and molding compound, a full qualification of assembled packages was completed. The qualification tests included MSL3 260C × 3 preconditioning followed by, TC-B 1000cycles, uHAST 144hrs & HTS 1000hrs.