Multichip module diagnosis

System diagnosis techniques for multichip module (MCM) functional test and diagnosis is presented. The proposed technique uses built-in additional probes for observations of modules´ internal responses. The faulty probes are located after the application of system functional test by a novel signature analysis based on error correcting codes. This signature scheme is essential for the viability of the built-in probe approach, since it is used to reduce the amount of wires and circuits entailed in signature analysis for the probed test responses. A bit-slice design of the probes signature analyzer is presented. Concepts from system diagnosis is used in conjunction with signature analysis in developing the proposed MCM diagnosis technique, where the resulting patterns of the faulty probes are used in the identification of the faulty submodules (dies)