DocumentCode
2037671
Title
FEM simulation to characterize wireless electric power transfer elements
Author
Ramos, Gabriel Vázquez ; Yuan, Jiann-shiun
Author_Institution
Launch Services Program, Nat. Aeronaut. & Space Adm., Cape Canaveral, FL, USA
fYear
2012
fDate
15-18 March 2012
Firstpage
1
Lastpage
4
Abstract
Wireless power transfer systems are expected to be a new mean for power distribution in the non-distant future for household electronics and handheld devices. However, even with the progress achieved to date, it is difficult to find literature that address the Federal Communications Commission, the Comité Européen or Military Standards compliance for electromagnetic emissions. This paper provides further insight for electromagnetic compatibility (EMC) compliance and coupling characterization considerations by performing Finite Element Method simulations. It was demonstrated by model simulation that Finite Element Method (FEM) provides adequate design insight for possible EMC compliance concerns before proceeding to the prototype phase. In addition, it was also demonstrated that FEM simulation provides adequate coupling characterization to determine the range of the wireless power transfer element as well as its optimal frequency of operation based on the separation distance between the transmitter element and the receiver element.
Keywords
electromagnetic compatibility; finite element analysis; power distribution; EMC compliance; FEM simulation; coupling characterization; electromagnetic compatibility; finite element method; handheld device; household electronics; power distribution; receiver element; separation distance; transmitter element; wireless electric power transfer element; Analytical models; Coils; Electromagnetics; Europe; Finite element methods; Transmitters; Wireless communication; electromagnetic compatibility; finite element method; magnetic coupling; magnetic resonance; power transfer; radiated emissions; wireless power;
fLanguage
English
Publisher
ieee
Conference_Titel
Southeastcon, 2012 Proceedings of IEEE
Conference_Location
Orlando, FL
ISSN
1091-0050
Print_ISBN
978-1-4673-1374-2
Type
conf
DOI
10.1109/SECon.2012.6196996
Filename
6196996
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