Abstract :
The following topics were dealt with: integrated optical interconnects; linear macromodeling; transmission lines; high-speed channels; electrical packaging; electrical interconnect; on-chip interconnects; carbon nanotube interconnects; interconnect characterization and interconnects modeling.
Keywords :
carbon nanotubes; electronics packaging; integrated circuit interconnections; integrated circuit modelling; integrated optoelectronics; nanoelectronics; nanotube devices; optical interconnections; carbon nanotube interconnects; electrical interconnect; electrical packaging; high-speed channels; integrated optical interconnects; interconnect characterization; interconnects modeling; linear macromodeling; on-chip interconnects; signal propagation; transmission lines;
Conference_Titel :
Signal Propagation on Interconnects, 2008. SPI 2008. 12th IEEE Workshop on
Conference_Location :
Avignon
Print_ISBN :
978-1-4244-2317-0
DOI :
10.1109/SPI.2008.4558330
