Title :
Pico-second time domain reflectometry response of a microstripline embedded in various liquids
Author :
Sharma, B.R. ; Mehrotra, S.C.
Author_Institution :
Dept. of Comput. Sci. & Inf. Technol., Aurangabad, India
Abstract :
A microstripline having 50 ohms characteristic impedance has been delineated on PCB type FR-4 board material, by using standard three layer dry film lamination and chemical photo-etching technology. The dielectric constant and dissipation factor for FR-4 substrate material is 4.6 and 0.018 at 1 MHz respectively. The fringing fields arising from free end of a microstripline have been employed to observe its free-end-dip liquid response. The microstripline has been vertically dipped in various liquids at different successive lengths. The response due to 40 pico second rise time pulse from free-end-dip of a microstripline in a liquid is observed on the TDR equipment in reflection mode at room temperature. The response waveform obtained is similar to the conventional co-axial transmission line connected to precision SMA cell containing liquid. The data analysis is carried out by standard Fourier transformation techniques. The microstripline of suitable length embedded in a liquid can be used as substitute to the SMA cell to determine the dielectric properties of various liquids.
Keywords :
Fourier transforms; etching; laminations; microstrip lines; permittivity; printed circuits; time-domain reflectometry; PCB type FR-4 board material; TDR equipment; chemical photo-etching technology; co-axial transmission line; dielectric constant; dielectric properties; dissipation factor; free-end-dip liquid response; fringing fields; impedance; microstripline; pico-second time domain reflectometry response; room temperature; standard Fourier transformation techniques; three layer dry film lamination; vertical dipping; Chemical technology; Dielectric constant; Dielectric materials; Dielectric substrates; Impedance; Lamination; Liquids; Microstrip; Optical films; Reflectometry;
Conference_Titel :
Dielectric Liquids, 2002. ICDL 2002. Proceedings of 2002 IEEE 14th International Conference on
Print_ISBN :
0-7803-7350-2
DOI :
10.1109/ICDL.2002.1022761