DocumentCode
2041580
Title
The 14th International Conference on Electronics Materials And Packaging (EMAP2012) [Copyright notice]
fYear
2012
fDate
13-16 Dec. 2012
Firstpage
1
Lastpage
1
Abstract
Copyright (c) 2012 by the Institute of Electrical and Electronics Engineers, Inc. All rights reserved. Copyright and Reprint Permission Abstracting is permitted with credit to the source. Libraries are permitted to photocopy beyond the limit of US copyright law, for private use of patrons, those articles in this volume that carry a code at the bottom of the first page, provided that the per-copy fee indicated in the code is paid through the Copyright Clearance Center, 222 Rosewood Drive, Danvers, MA 01923. Other copying, reprint, or reproduction requests should be addressed to IEEE Copyrights Manager, IEEE Service Center, 445 Hoes Lane, P.O. Box 1331, Piscataway, NJ 08855-1331. IEEE Catalog Number CFP12506-ART. ISBN 978-1-4673-4944-4. ISSN N/A.
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging (EMAP), 2012 14th International Conference on
Conference_Location
Lantau Island, Hong Kong
Print_ISBN
978-1-4673-4945-1
Electronic_ISBN
978-1-4673-4943-7
Type
conf
DOI
10.1109/EMAP.2012.6507829
Filename
6507829
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