• DocumentCode
    2041580
  • Title

    The 14th International Conference on Electronics Materials And Packaging (EMAP2012) [Copyright notice]

  • fYear
    2012
  • fDate
    13-16 Dec. 2012
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Copyright (c) 2012 by the Institute of Electrical and Electronics Engineers, Inc. All rights reserved. Copyright and Reprint Permission Abstracting is permitted with credit to the source. Libraries are permitted to photocopy beyond the limit of US copyright law, for private use of patrons, those articles in this volume that carry a code at the bottom of the first page, provided that the per-copy fee indicated in the code is paid through the Copyright Clearance Center, 222 Rosewood Drive, Danvers, MA 01923. Other copying, reprint, or reproduction requests should be addressed to IEEE Copyrights Manager, IEEE Service Center, 445 Hoes Lane, P.O. Box 1331, Piscataway, NJ 08855-1331. IEEE Catalog Number CFP12506-ART. ISBN 978-1-4673-4944-4. ISSN N/A.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging (EMAP), 2012 14th International Conference on
  • Conference_Location
    Lantau Island, Hong Kong
  • Print_ISBN
    978-1-4673-4945-1
  • Electronic_ISBN
    978-1-4673-4943-7
  • Type

    conf

  • DOI
    10.1109/EMAP.2012.6507829
  • Filename
    6507829