Packaging of microelectronics for thermo-mechanical environments

In the wake of the recent dramatic advances made in electronic products, product size has become smaller and smaller. As a result of this, electronic components will be affected easily by environmental factors such as humidity, pressure, and temperature. This paper discusses the flip chip packaging, which is affected by changes in temperature. Because the electronic components often failed by thermo-mechanical loadings, which leads solder joints to crack and separate with HIC (Hybrid Integrated Circuit) and PCB (Printed circuit board). Solder joints are the interconnections of the flip chip assemblies, and they are also responsible for transferring signals. Thus, they are the most important components in the flip chip assemblies. Hence, this paper mainly analyzes the largest stresses that occur in the solder joints, and establishes the relationship of the geometries and the material properties. Then, possible ways of changing flip chip parameters to improve the reliability of the flip chip structure are discussed. This research uses ANSYS software, which is based on finite element theory in order to reduce time used and save money, as finite element simulation provides results more quickly and cheaply than experiments. Besides, it can also predict the reliability of the flip chip. Finally, presenting the simulation results and contrasting these with the theoretical results provides good accuracy. The simulation results are able to provide the optimal design of flip chip assemblies.