PC 3000-the new generation of isotropic conductive adhesives

Author

Neumann-Rodekirch, Jens ; Hagedorn, Hans-Werner

Author_Institution

Heraeus (W.C.) GmbH, Hanau, Germany

fYear

2001

fDate

21-24 Oct. 2001

Firstpage

70

Abstract

Summary form only given. The use of conductive adhesives as a completion of soldering is becoming more and more important for mounting electronic components and bare dies on substrates. The new PC 3000, a thermosetting, single-component, solvent-free, silver-filled, isotropic conductive adhesive (ICA) is presented. Application examples for the automotive and telecommunication industries are shown. Advantages like outstanding thermal conductivity are demonstrated and some special aspects with regard to properties and processing are discussed.

Keywords

adhesives; assembling; automotive electronics; conducting polymers; filled polymers; plastic packaging; telecommunication equipment; Ag; PC 3000 isotropic conductive adhesives; adhesive processing; adhesive properties; automotive industry; bare die mounting; conductive adhesives; electronic component mounting; single-component solvent-free isotropic conductive adhesive; soldering; telecommunication industry; thermal conductivity; thermosetting Ag-filled isotropic conductive adhesive; Automotive engineering; Communication industry; Conductive adhesives; Electronic components; Independent component analysis; Soldering; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on

Conference_Location

Potsdam, Germany

Print_ISBN

0-7803-7220-4

Type

conf

DOI

10.1109/POLYTR.2001.973259

Filename

973259