DocumentCode :
2048009
Title :
Energy-based methodology for the fatigue-life prediction of solder materials
Author :
Vaymman, S. ; McKeown, Stephen A.
Author_Institution :
Ind. Res. Lab., Northwestern Univ., Evanston, IL, USA
fYear :
1991
fDate :
11-16 May 1991
Firstpage :
671
Lastpage :
676
Abstract :
An energy-based damage criterion, which has not been used previously in solder fatigue-life assessment, was found to be superior to a plastic strain criterion in predicting the fatigue life of different solders. Solder specimens of different size and geometry were tested under different types of control and with different loading modes and aging conditions. The energy-based damage concept was used to interpret aging effects in 63Sn-37Pb solder
Keywords :
ageing; fatigue testing; lead alloys; soldering; tin alloys; SnPb solder; aging conditions; energy-based damage criterion; fatigue-life prediction; geometry; loading modes; size; solder materials; Aerospace materials; Capacitive sensors; Fatigue; Hysteresis; Plastics; Soldering; Strain measurement; Stress; Temperature; Thermal expansion;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-0012-2
Type :
conf
DOI :
10.1109/ECTC.1991.163952
Filename :
163952
Link To Document :
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