DocumentCode :
2051797
Title :
Reliability assessment of high temperature electronics and packaging technologies for Venus mission
Author :
Chen, Yuan ; Castillo, Linda Del ; Aranki, Nazeeh ; Assad, Chris ; Mazzola, Mike ; Mojarradi, Mohammad ; Kolawa, Elizabeth
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA
fYear :
2008
fDate :
April 27 2008-May 1 2008
Firstpage :
641
Lastpage :
642
Abstract :
In this paper, the potentials of the current state-of-the-art electronics and packaging technologies for Venus missions is evaluated and intend to address the survivability and reliability of the selected technologies and develop design-for-reliability guidelines for mission integration.
Keywords :
electronics packaging; high-temperature electronics; reliability; Venus mission; high temperature electronics; packaging technology; reliability assessment; Degradation; Electronic equipment testing; Electronic packaging thermal management; Electronics packaging; Laboratories; Performance evaluation; Stress; Temperature sensors; Venus; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 2008. IRPS 2008. IEEE International
Conference_Location :
Phoenix, AZ
Print_ISBN :
978-1-4244-2049-0
Electronic_ISBN :
978-1-4244-2050-6
Type :
conf
DOI :
10.1109/RELPHY.2008.4558966
Filename :
4558966
Link To Document :
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