Modelling and control of a 2-DOF planar parallel manipulator for semiconductor packaging systems

A novel direct-drive planar parallel manipulator for high-speed and high-precision semiconductor packaging systems is presented. High precision kinematics design, significant reduction on moving mass and driving power of the actuators over traditional XY motion stages are the benefits of the proposed manipulator. The mathematical model of the manipulator is obtained using the Newton-Euler method and a practical model-based control design approach is employed to design the PID computed-torque controller. Experimental results demonstrate that the proposed planar parallel manipulator has significant improvements on motion performance in terms of positioning accuracy, settling time and stability when compared with traditional XY stages. This shows that the proposed planar parallel manipulator can provide a superior alternative for replacing traditional XY motion stages in high precision low-payload applications