• DocumentCode
    2054765
  • Title

    A New Fabrication Method for 3D Multilayer Microstructure

  • Author

    Jing, Xiangmeng ; Chen, Di ; Zhang, Baozeng ; Liu, Jingquan ; Zhu, Jun

  • Author_Institution
    Nat. Key Lab. of Micro/Nano Fabrication Technol., Shanghai Jiao Tong Univ.
  • fYear
    2006
  • fDate
    18-21 Jan. 2006
  • Firstpage
    567
  • Lastpage
    570
  • Abstract
    A new method for realization of 3D multilayer micro structures is presented in this paper. It consists of two major processes: silicon etching process and UV-LIGA process. In this way, some shape limitations of single technology can be overcome for new functions. By combining these processes, multilayer structures and complex graphics can be fabricated. To make good combination, the adhesive characteristics between the SU-8 photoresist and the surface of etched silicon substrate was studied. Two steps that can thoroughly remove bubbles in the etched silicon groove are also employed. To demonstrate this combination of micro fabrication process, some SU-8 microstructures are successfully fabricated in the etched silicon grooves. This method has applications in multi-layer microstructure fabrication
  • Keywords
    electroplating; etching; micromachining; moulding; photoresists; 3D multilayer microstructure fabrication; SU-8 microstructures; SU-8 photoresist; Si; UV-LIGA process; adhesive characteristics; etched silicon grooves; etched silicon substrate surface; lithografie-galvanoformung-abformung; microfabrication; silicon etching process; Etching; Fabrication; Laboratories; Machining; Microstructure; Nonhomogeneous media; Resists; Shape; Silicon; Synchrotrons; 3D-microfabrication; SU-8; UV-LIGA; bulk silicon micro machining;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2006. NEMS '06. 1st IEEE International Conference on
  • Conference_Location
    Zhuhai
  • Print_ISBN
    1-4244-0139-9
  • Electronic_ISBN
    1-4244-0140-2
  • Type

    conf

  • DOI
    10.1109/NEMS.2006.334846
  • Filename
    4135019