DocumentCode
2054765
Title
A New Fabrication Method for 3D Multilayer Microstructure
Author
Jing, Xiangmeng ; Chen, Di ; Zhang, Baozeng ; Liu, Jingquan ; Zhu, Jun
Author_Institution
Nat. Key Lab. of Micro/Nano Fabrication Technol., Shanghai Jiao Tong Univ.
fYear
2006
fDate
18-21 Jan. 2006
Firstpage
567
Lastpage
570
Abstract
A new method for realization of 3D multilayer micro structures is presented in this paper. It consists of two major processes: silicon etching process and UV-LIGA process. In this way, some shape limitations of single technology can be overcome for new functions. By combining these processes, multilayer structures and complex graphics can be fabricated. To make good combination, the adhesive characteristics between the SU-8 photoresist and the surface of etched silicon substrate was studied. Two steps that can thoroughly remove bubbles in the etched silicon groove are also employed. To demonstrate this combination of micro fabrication process, some SU-8 microstructures are successfully fabricated in the etched silicon grooves. This method has applications in multi-layer microstructure fabrication
Keywords
electroplating; etching; micromachining; moulding; photoresists; 3D multilayer microstructure fabrication; SU-8 microstructures; SU-8 photoresist; Si; UV-LIGA process; adhesive characteristics; etched silicon grooves; etched silicon substrate surface; lithografie-galvanoformung-abformung; microfabrication; silicon etching process; Etching; Fabrication; Laboratories; Machining; Microstructure; Nonhomogeneous media; Resists; Shape; Silicon; Synchrotrons; 3D-microfabrication; SU-8; UV-LIGA; bulk silicon micro machining;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems, 2006. NEMS '06. 1st IEEE International Conference on
Conference_Location
Zhuhai
Print_ISBN
1-4244-0139-9
Electronic_ISBN
1-4244-0140-2
Type
conf
DOI
10.1109/NEMS.2006.334846
Filename
4135019
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