• DocumentCode
    2058201
  • Title

    Compact thermal model of a three-phase IGBT inverter power module

  • Author

    Zhou, Z. ; Holland, P.M. ; Igic, P.

  • Author_Institution
    Inst. of Innovation, Swansea Univ., Swansea
  • fYear
    2008
  • fDate
    11-14 May 2008
  • Firstpage
    167
  • Lastpage
    170
  • Abstract
    A compact thermal model of a three-phase IGBT inverter power module utilised in most of variable speed drivers has been described in this paper. The compact thermal model equals to an electrical RC network model is assembled from thermal resistances and thermal capacitances so that it can be easily implemented in a circuit simulator. Transient thermal 3D finite element (FE) model of the IGBT module has been carried out using commercially available FLOTHERM software; the 3D simulation results are then utilised to extract the compact thermal network parameters of the IGBT power modular. Good agreement has been achieved between simulation and experimental measurement.
  • Keywords
    insulated gate bipolar transistors; modules; semiconductor device models; thermal resistance; FLOTHERM; thermal 3D finite element model; thermal capacitance; thermal resistance; three-phase IGBT inverter power module; Assembly; Capacitance; Circuit simulation; Diodes; Finite element methods; Insulated gate bipolar transistors; Inverters; Multichip modules; Packaging; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics, 2008. MIEL 2008. 26th International Conference on
  • Conference_Location
    Nis
  • Print_ISBN
    978-1-4244-1881-7
  • Electronic_ISBN
    978-1-4244-1882-4
  • Type

    conf

  • DOI
    10.1109/ICMEL.2008.4559249
  • Filename
    4559249