DocumentCode
2058201
Title
Compact thermal model of a three-phase IGBT inverter power module
Author
Zhou, Z. ; Holland, P.M. ; Igic, P.
Author_Institution
Inst. of Innovation, Swansea Univ., Swansea
fYear
2008
fDate
11-14 May 2008
Firstpage
167
Lastpage
170
Abstract
A compact thermal model of a three-phase IGBT inverter power module utilised in most of variable speed drivers has been described in this paper. The compact thermal model equals to an electrical RC network model is assembled from thermal resistances and thermal capacitances so that it can be easily implemented in a circuit simulator. Transient thermal 3D finite element (FE) model of the IGBT module has been carried out using commercially available FLOTHERM software; the 3D simulation results are then utilised to extract the compact thermal network parameters of the IGBT power modular. Good agreement has been achieved between simulation and experimental measurement.
Keywords
insulated gate bipolar transistors; modules; semiconductor device models; thermal resistance; FLOTHERM; thermal 3D finite element model; thermal capacitance; thermal resistance; three-phase IGBT inverter power module; Assembly; Capacitance; Circuit simulation; Diodes; Finite element methods; Insulated gate bipolar transistors; Inverters; Multichip modules; Packaging; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics, 2008. MIEL 2008. 26th International Conference on
Conference_Location
Nis
Print_ISBN
978-1-4244-1881-7
Electronic_ISBN
978-1-4244-1882-4
Type
conf
DOI
10.1109/ICMEL.2008.4559249
Filename
4559249
Link To Document