The mechanical properties of thin polymer film for nanoimprinting lithography by nanoindentation

Author

Lee, H.J. ; Hur, S. ; Han, S.W. ; Kim, J.H. ; Oh, C.-S. ; Ko, S.G.

Author_Institution

Korea Inst. of Machinery & Mater., Daejeon, South Korea

Volume

2

fYear

2003

fDate

12-14 Aug. 2003

Firstpage

546

Abstract

Two thin polymer films (mr-I-8030 and mr-I-9030) for nanoimprinting lithography are coated on 4 inches silicon wafers. Nanoindentation tests are performed to measure the mechanical properties, Young´s modulus and hardness, of these thin films having the thicknesses of around 130, 200, and 400 nm. The primary elastic modulus and the viscoelastic properties are derived from the creep. The modulus values obtained by these methods are compared. The plastic deformation of these films after indentation is analyzed by using a scanning probe microscope.

Keywords

Young´s modulus; creep; hardness; indentation; plastic deformation; polymer films; scanning probe microscopy; viscoelasticity; 130 nm; 200 nm; 400 nm; Si; Young´s modulus; creep; elastic modulus; hardness; mechanical properties; nanoimprinting lithography; nanoindentation; plastic deformation; scanning probe microscopy; silicon wafers; thin polymer films; viscoelastic properties; Lithography; Mechanical factors; Mechanical variables measurement; Performance evaluation; Plastic films; Polymer films; Silicon; Testing; Thickness measurement; Viscosity;

fLanguage

English

Publisher

ieee

Conference_Titel

Nanotechnology, 2003. IEEE-NANO 2003. 2003 Third IEEE Conference on

Print_ISBN

0-7803-7976-4

Type

conf

DOI

10.1109/NANO.2003.1230968

Filename

1230968