Title :
Polypyrrole-coated Fabric Strain Sensor with High Sensitivity and Good Stability
Author :
Cheng, Xiaoyin ; Li, Yang ; Tao, Xiaoming ; Tsang, H.Y.J. ; Mei Yi Leung ; Xue, Pu ; Cheng, Xiaoxiang ; Yuen, C.W.M.
Author_Institution :
Nanotechnology Center, Hong Kong Polytech. Univ.
Abstract :
The sensitivity and stability are mainly factors to hold back the practical applications of Polypyrrole coated fabrics. In this paper, a flexible fabric strain sensor with high sensitivity, good stability and large deformation is reported. It is fabricated by depositing a nano-layer (200nm to 300nm) of polypyrrole on the fabric substrate at low temperature. Thickness and morphology of the conducting thin film on the surface of the fibers were examined by scanning probe microscopy (SPM) and scanning electron microscopy (SEM). The measurement of the conductivity change with strain shows the fabrics so prepared exhibits a high strain sensitivity of ~160 for a deformation as large as 50%, while its good stability is indicated by a small loss of conductivity after the thermal and humidity aging tests, and supported by the slight change in conductivity and sensitivity over a storage of eighteen months. The flexible strain sensor is expected to be a promising "soft" smart material with good sensing properties in the preparation of smart garment, wearable hardware and biomedical applications
Keywords :
conducting polymers; fabrics; scanning electron microscopy; scanning probe microscopy; strain ageing; strain sensors; surface morphology; thin films; 200 to 300 nm; SEM analysis; SPM analysis; conductivity; fabric strain sensor; humidity aging; nanolayer; polypyrrole coating; scanning electron microscopy; scanning probe microscopy; stability; thermal aging; thin film morphology; Capacitive sensors; Fabrics; Morphology; Scanning electron microscopy; Scanning probe microscopy; Stability; Strain measurement; Substrates; Temperature sensors; Thermal conductivity; fabric strain sensor; polypyrrole; stability;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems, 2006. NEMS '06. 1st IEEE International Conference on
Conference_Location :
Zhuhai
Print_ISBN :
1-4244-0139-9
Electronic_ISBN :
1-4244-0140-2
DOI :
10.1109/NEMS.2006.334708