DocumentCode :
2060173
Title :
Silicon Micromachining by CO2 Laser
Author :
Chung, C.K. ; Wu, M.Y. ; Wu, J.C. ; Sung, Y.C. ; Huang, G.R.
Author_Institution :
Dep´´t of Mech. Eng., National Cheng Kung Univ., Tainan
fYear :
2006
fDate :
18-21 Jan. 2006
Firstpage :
1445
Lastpage :
1448
Abstract :
In this paper, a novel silicon micromachining using CO2 laser has been demonstrated for the first time. The wavelength of CO2 laser is 10.64 mum and not absorbed by silicon material. So, it cannot do any micromachining for pure silicon. However, as we put a silicon on the top of a glass material, CO2 laser can etch the silicon, even etch through the wafer to be a hole structure. For example, a silicon hole of 525 mum deep can be obtained by CO2 laser machining circular shape for 80 passes at power of 24 W, spot size of 76 mum and scanning speed of 6 mm/sec. In comparison with conventional laser micromachining of silicon, shorter wavelength lasers e.g. Nd:YAG laser with wavelength of 1.06 mum and excimer laser of 248 or 193 nm are used due to the good adsorption of silicon. But the cost of shorter wavelength laser is much higher than CO 2 laser. In comparison with conventional silicon micromachining by dry plasma etching, wet KOH/TMAH etching or wire electrodischarge grinding (WEDG), CO2 laser micromachining is much easier, cheaper and has faster etching rate than plasma etching, and more flexible to make different geometry than wet etching and WEDG. This CO2 laser micromachined silicon technology will be a promising one for the application of microfabrication and MEMS
Keywords :
carbon compounds; gas lasers; laser beam etching; micromachining; silicon; 1.06 micron; 10.64 micron; 193 nm; 24 W; 248 nm; 525 micron; 6 mm/s; 76 micron; CO2; MEMS; Nd:YAG; WEDG; adsorption; carbon dioxide laser; dry plasma etching; excimer laser; laser micromachining; microelectromechanical system; microfabrication; micromachined silicon technology; silicon micromachining; wet KOH/TMAH etching; wire electrodischarge grinding; Dry etching; Glass; Machining; Micromachining; Optical materials; Plasma applications; Power lasers; Shape; Silicon; Wet etching; CO2 laser; MEMS; Si micromachining; etching;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems, 2006. NEMS '06. 1st IEEE International Conference on
Conference_Location :
Zhuhai
Print_ISBN :
1-4244-0139-9
Electronic_ISBN :
1-4244-0140-2
Type :
conf
DOI :
10.1109/NEMS.2006.334785
Filename :
4135215
Link To Document :
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