• DocumentCode
    2060732
  • Title

    Towards batch fabrication of bundled carbon nanotube thermal sensors

  • Author

    Fung, Carmen K M ; Wong, Victor T S ; Li, Wen J.

  • Author_Institution
    Centre for Micro & Nano Syst., Hong Kong Univ., China
  • Volume
    2
  • fYear
    2003
  • fDate
    12-14 Aug. 2003
  • Firstpage
    866
  • Abstract
    A new approach for batch fabrication of carbon nanotubes (CNT) based MEMS thermal sensor was developed using AC electrophoretic manipulation of MWNT bundles on a silicon substrate. Based on this technique, CNT were successfully and repeatably manipulated by AC electrophoresis to form resistive elements between Au microelectrodes. We have preliminarily proved the feasibility to batch assembly of CNT devices with greater than 70% success rate. Besides, the devices were demonstrated to potentially serve as novel thermal sensors. We have measured the temperature coefficient of resistance (TCR) of these MWNT-based micro sensors and also integrated them into constant current configuration for dynamic characterization. The I-V measurements of the resulting devices revealed that their power consumption were in the μW range. Based on these experimental evidences and our proposed new approach, a feasible batch manufacturable scheme for functional CNT based thermal sensors is suggested which will dramatically reduce production costs of nano sensing devices and potentially enable fully automated assembly of CNT-based devices.
  • Keywords
    batch processing (industrial); carbon nanotubes; electrophoresis; microelectrodes; micromechanical devices; microsensors; nanotechnology; power consumption; temperature sensors; AC electrophoretic manipulation; Au microelectrodes; C; I-V measurements; MWNT based micro sensors; Si; TCR; batch fabrication; bundled carbon nanotube thermal sensors; carbon nanotubes based MEMS thermal sensor; constant current configuration; dynamic characterization; feasibility; formresistive elements; nanosensing devices; power consumption; resistance temperature coefficient; silicon substrate; Assembly; Carbon nanotubes; Electrical resistance measurement; Fabrication; Micromechanical devices; Sensor phenomena and characterization; Silicon; Temperature measurement; Temperature sensors; Thermal sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanotechnology, 2003. IEEE-NANO 2003. 2003 Third IEEE Conference on
  • Print_ISBN
    0-7803-7976-4
  • Type

    conf

  • DOI
    10.1109/NANO.2003.1231052
  • Filename
    1231052