DocumentCode
2064482
Title
Analysis inductively coupling wireless connection in 3D package
Author
BaoCun Wang ; Yu Guoyi ; Xiaofei Chen ; Li Zhang ; Zou, X.
Author_Institution
Sch. of Opt. & Electron. Inf., Zhuazhong Univ. of Sci. & Technol., Wuhan, China
fYear
2013
fDate
28-31 Oct. 2013
Firstpage
1
Lastpage
5
Abstract
A accuracy physical model and Greenhouse algorithm is presented in this paper in 3D package. A relative simple and fast method of calculation the coupling inductors coefficient is presented in this paper. The parameters of the inductors coupling is high efficiency are discussed. The appropriate position is calculated where the interference of inductor channel is minimum in the 3D package.
Keywords
coupled circuits; inductors; integrated circuit interconnections; integrated circuit packaging; three-dimensional integrated circuits; 3D package; Greenhouse algorithm; coupling inductor coefficient; inductively coupling wireless connection; inductor channel; Arrays; Couplings; Inductance; Inductors; Interference; Three-dimensional displays; Wireless communication; 3D package; High speed interconnect; inductive coupling;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC (ASICON), 2013 IEEE 10th International Conference on
Conference_Location
Shenzhen
ISSN
2162-7541
Print_ISBN
978-1-4673-6415-7
Type
conf
DOI
10.1109/ASICON.2013.6811861
Filename
6811861
Link To Document