Title :
IC failure analysis tools and techniques-magic, mystery, and science
Author :
Soden, Jerry M. ; Anderson, Richard E. ; Henderson, Christopher L.
Author_Institution :
Failure Anal. Dept., Sandia Nat. Labs., Albuquerque, NM, USA
Abstract :
This review includes a discussion of the advances being made to meet the challenges presented by state-of-the-art IC and packaging technologies, since these provide the motivation and direction for the future of FA. New capabilities are required for ICs with features such as additional interconnection layers, power distribution planes, or flip chip packaging that reduce or prevent the use of conventional methods without destructive deprocessing. To support improved time to market and yield enhancement, the industry needs diagnostic techniques that provide logical and physical localization in real time during production testing
Keywords :
failure analysis; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; integrated circuit yield; production testing; IC failure analysis; diagnostic techniques; failure analysis tools; flip chip packaging; interconnection layers; packaging technologies; power distribution planes; production testing; time to market; yield enhancement; Atomic force microscopy; Electron beams; Electron optics; Failure analysis; Integrated circuit packaging; Integrated circuit testing; Laboratories; Optical microscopy; Photonic integrated circuits; Probes;
Conference_Titel :
Test Conference, 1996. Proceedings., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-3541-4
DOI :
10.1109/TEST.1996.557164
