DocumentCode :
2066509
Title :
27.4 A 0.8mm3 ±0.68psi single-chip wireless pressure sensor for TPMS applications
Author :
Nagaraju, Manohar B. ; Lingley, Andrew R. ; Sridharan, Suresh ; Jingren Gu ; Ruby, Richard ; Otis, Brian P.
Author_Institution :
Univ. of Washington, Seattle, WA, USA
fYear :
2015
fDate :
22-26 Feb. 2015
Firstpage :
1
Lastpage :
3
Abstract :
This work presents a single-chip sub-mm3 wireless pressure sensor suitable for tire pressure monitoring. The dynamic behavior and safety of an automobile tire is closely dependent on its inflation pressure: maintaining the manufacturer-recommended pressure is essential to prevent tire failure, provide stability, improve fuel efficiency and tire-life, and to reduce C02 emissions [1]. Thus, Tire-Pressure Monitoring Systems (TPMS) have become an essential component in modern vehicles, as stipulated by the National Highway Traffic Safety Administration (NHTSA) in 2006. State-of-the-art TPMS systems currently require a pressure sensor, multiple ICs, several external components, and a crystal on a PCB allowing wireless transmission of tire pressure [2] [3]. In this work, we describe a sub-mm3 fully integrated wireless pressure sensor including a pressure transducer, interface circuitry, integrated timing reference, and a wireless transmitter integrated into a single die.
Keywords :
air pollution control; condition monitoring; failure analysis; pressure sensors; pressure transducers; road safety; tyres; wireless sensor networks; CO2 emission reduction; NHTSA; National Highway Traffic Safety Administration; PCB; TPMS applications; automobile tire safety; dynamic behavior; fuel efficiency improvement; inflation pressure; integrated single chip wireless pressure sensor; integrated timing reference; interface circuitry; pressure transducer; stability; tire failure prevention; tire pressure monitoring systems; wireless transmission; wireless transmitter; Film bulk acoustic resonators; Frequency measurement; Frequency shift keying; Oscillators; Sensors; Wireless communication; Wireless sensor networks;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid- State Circuits Conference - (ISSCC), 2015 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4799-6223-5
Type :
conf
DOI :
10.1109/ISSCC.2015.7063135
Filename :
7063135
Link To Document :
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