Title :
Die attach adhesion on leadframes treated with antioxidants
Author :
Huneke, James T. ; Cowens, Marvin
Author_Institution :
Quantum Mater. Inc., San Diego, CA, USA
Abstract :
Antioxidant treatment of leadframes can reduce the initial die attach adhesion if the deposit creates an excess unbonded layer. The benzotriazole class of antioxidants can reduce the die attach adhesion over time by undergoing reactions that disrupt the leadframe/adhesive interface. The surface analysis techniques AES and ToF-SIMS were used to characterize the difference between good and bad leadframes. Other leadframe treatments were evaluated which have no effect on adhesion. These include the hindered phenol, hydrazine and thioester antioxidant compounds, as well as the inorganic A2 treatment. Cleaning methods for leadframes are proposed which are compatible with electronic packaging assembly lines
Keywords :
Auger electron spectra; adhesion; adhesives; integrated circuit packaging; microassembling; oxidation; secondary ion mass spectra; surface chemistry; surface cleaning; surface contamination; time of flight mass spectra; AES; ToF-SIMS; adhesion; antioxidant treatment; antioxidants; benzotriazole antioxidants; cleaning methods; die attach adhesion; electronic packaging assembly lines; excess unbonded layer; hindered phenol antioxidant compounds; hydrazine antioxidant compounds; inorganic A2 treatment; leadframe treatments; leadframe/adhesive interface; leadframe/adhesive interface reactions; leadframes; surface analysis techniques; thioester antioxidant compounds; Adhesives; Assembly; Bonding; Coatings; Copper; Electronics packaging; Lead; Microassembly; Resins; Surface treatment;
Conference_Titel :
Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st
Print_ISBN :
0-7803-4157-0
DOI :
10.1109/EPTC.1997.723911
