DocumentCode :
2067736
Title :
Thermal Design of HBT Power Transistors for Mobile and Satellite Communications
Author :
Mezui-Mintsa, R. ; Tsouli, M. ; Enkonda, Z. ; Hassaïne, N. ; Riet, M. ; Villeforceix, B. ; Konczykowska, A. ; Vuye, S. ; Wang, H.
Author_Institution :
Centre National d´´Etudes des Télécommunications, Laboratoire de Bagneux, 196, avenue Henri Ravera, 92220 Bagneux (FRANCE)
Volume :
2
fYear :
1992
fDate :
5-9 Sept. 1992
Firstpage :
856
Lastpage :
859
Abstract :
HBT power transistors thermal analysis and its application to amplifier design are presented in this paper. Device analysis and optimization have been made with respect to the power handling capability. Power HBTs for mobile and satellite communications have been fabricated. A C-band MIC amplifier is also presented.
Keywords :
Current density; Electronic ballasts; Fingers; Frequency; Heterojunction bipolar transistors; Power amplifiers; Power transistors; Satellite communication; Temperature; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 1992. 22nd European
Conference_Location :
Helsinki, Finland
Type :
conf
DOI :
10.1109/EUMA.1992.335812
Filename :
4135557
Link To Document :
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