Title :
Hybrid routing on multichip modules
Author :
Tsai, Chia-Chun ; Chen, Sao-Jie ; Hsiao, Pei-Yung ; Feng, Wu-Shiung
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Abstract :
A hybrid routing approach for multichip modules (MCMs) is proposed. The routing implementation is divided into three stages: signal-net routing, I/O-pad interconnection, and power/ground layout. A special feature of the implementation is that, in the second stage, some interconnected segments are allowed to be tilted with a slope for reducing the MCM layout area. Experimental results on MCM examples indicate that the performance of the hybrid routing is very encouraging
Keywords :
circuit layout CAD; hybrid integrated circuits; modules; I/O-pad interconnection; MCM layout area; hybrid routing approach; interconnected segments; multichip modules; power/ground layout; signal-net routing; Integrated circuit interconnections; Multichip modules; Packaging; Power system interconnection; Routing; Semiconductor device measurement; Signal processing; Testing; Wires; Wiring;
Conference_Titel :
Custom Integrated Circuits Conference, 1991., Proceedings of the IEEE 1991
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0015-7
DOI :
10.1109/CICC.1991.164038
