122 GHz antenna-integration in a plastic package based on a flip chip interconnect

Author

Beer, Stefan ; Zwick, Thomas

Author_Institution

Inst. fuer Hochfrequenztech. und Elektron., Karlsruhe Inst. of Technol., Karlsruhe, Germany

fYear

2011

fDate

15-16 Sept. 2011

Firstpage

37

Lastpage

40

Abstract

The paper introduces a packaging concept for the integration of a 122 GHz MMIC and a separate off-chip antenna into a plastic QFN package. The concept is explained and the advantages compared to previous concepts are given. As the concept incorporates a 122 GHz chip to antenna interconnect based on flip chip technology, measurements and simulations of such an interconnect are presented to evaluate the performance. Finally, a possible antenna design is presented together with the measurement results of this antenna.

Keywords

MIMIC; MMIC; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; millimetre wave antennas; plastic packaging; MMIC; antenna design; antenna integration; antenna interconnect; flip chip interconnect; frequency 122 GHz; off-chip antenna; plastic QFN package; Antenna measurements; Antennas; Cavity resonators; Flip chip; Semiconductor device measurement; Substrates; Transmission line measurements; Millimeter-waves; flip chip; integrated antenna; packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Workshop Series on Millimeter Wave Integration Technologies (IMWS), 2011 IEEE MTT-S International

Conference_Location

Sitges

Print_ISBN

978-1-61284-963-8

Type

conf

DOI

10.1109/IMWS3.2011.6061881

Filename

6061881