Title :
Deflection routing in 3D Network-on-Chip with TSV serialization
Author :
Jinho Lee ; Dongwoo Lee ; Sunwook Kim ; Kiyoung Choi
Author_Institution :
Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., Seoul, South Korea
Abstract :
This paper proposes a deflection routing for 3D NoC with serialized TSVs. Bufferless deflection routing provides area- and power-efficient communication under low to medium traffic load. Under 3D circumstances, the bufferless deflection routing can yield even better performance than buffered routing when key aspects are properly taken into account. Evaluation of the proposed scheme shows its effectiveness in throughput, latency, and energy consumption.
Keywords :
network-on-chip; three-dimensional integrated circuits; 3D NoC; 3D network on chip; TSV serialization; bufferless deflection routing; energy consumption; latency; power efficient communication; serialized TSV; Bandwidth; Ports (Computers); Routing; System recovery; Three-dimensional displays; Through-silicon vias; Throughput;
Conference_Titel :
Design Automation Conference (ASP-DAC), 2013 18th Asia and South Pacific
Conference_Location :
Yokohama
Print_ISBN :
978-1-4673-3029-9
DOI :
10.1109/ASPDAC.2013.6509554