DocumentCode :
2072282
Title :
Deflection routing in 3D Network-on-Chip with TSV serialization
Author :
Jinho Lee ; Dongwoo Lee ; Sunwook Kim ; Kiyoung Choi
Author_Institution :
Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., Seoul, South Korea
fYear :
2013
fDate :
22-25 Jan. 2013
Firstpage :
29
Lastpage :
34
Abstract :
This paper proposes a deflection routing for 3D NoC with serialized TSVs. Bufferless deflection routing provides area- and power-efficient communication under low to medium traffic load. Under 3D circumstances, the bufferless deflection routing can yield even better performance than buffered routing when key aspects are properly taken into account. Evaluation of the proposed scheme shows its effectiveness in throughput, latency, and energy consumption.
Keywords :
network-on-chip; three-dimensional integrated circuits; 3D NoC; 3D network on chip; TSV serialization; bufferless deflection routing; energy consumption; latency; power efficient communication; serialized TSV; Bandwidth; Ports (Computers); Routing; System recovery; Three-dimensional displays; Through-silicon vias; Throughput;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference (ASP-DAC), 2013 18th Asia and South Pacific
Conference_Location :
Yokohama
ISSN :
2153-6961
Print_ISBN :
978-1-4673-3029-9
Type :
conf
DOI :
10.1109/ASPDAC.2013.6509554
Filename :
6509554
Link To Document :
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