Packaging system S-parameter model decomposition and on-demand composition using directional junctions for signal integrity transient simulation

A simple method for packaging system S-parameter model decomposition and on-demand composition on the circuit model level is proposed in this paper to make the multi-aggressor single-victim channel group circuit modeling easier, more flexible, and more manageable. This approach uses the concept of the directional junction model proposed in [1][2] combined with small two-port single-channel circuit model and four-port single crosstalk circuit model as building bricks. The system SI transient simulation using the composited model is very accurate compared with the one using the original full-matrix or sparse matrix channel group S-parameter model.