• DocumentCode
    2076293
  • Title

    High thermal conductivity, lossy aluminum nitride dielectrics

  • Author

    Savrun, E. ; Abe, D.

  • Author_Institution
    Sienna Technol. Inc., Woodinville, WA, USA
  • fYear
    2000
  • fDate
    2-4 May 2000
  • Abstract
    Sienna Technologies, Inc., has successfully demonstrated that high thermal conductivity of aluminum nitride (AlN) can be alloyed or composited to increase its microwave losses without significant reduction in thermal conductivity to substitute for BeO-SiC composites in microwave tubes. Doped AlN and AlN composites were fabricated and their thermal conductivities and complex permittivities from 9 GHz to 12 GHz were measured and compared to those of BeO-SiC composites. AlN composites displayed the same loss tangent (0.455 at 9 GHz, and 0.588 at 12 GHz) and a comparable thermal conductivity (l05 W/m.K) as the 60BeO-40SiC composite (0.493 at 9 GHz, and 0.587 at 12 GHz). Doped AlN had a loss tangent of between 0.37 and 0.75 at 12 GHz with a dielectric constant of between 19 and 37, depending on dopant concentration. The thermal conductivity of doped AlN (150 W/m.K) was higher than that of 60BeO-40SiC composite (130 W/m.K).
  • Keywords
    aluminium compounds; ceramics; dielectric losses; permittivity; thermal conductivity; 9 to 12 GHz; AlN; high thermal conductivity; loss tangent; lossy AlN dielectrics; microwave losses; permittivities; Aluminum nitride; Anisotropic magnetoresistance; Dielectric losses; Laboratories; Microstructure; Microwave technology; Permittivity; Shape; Silicon carbide; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Electronics Conference, 2000. Abstracts. International
  • Conference_Location
    Monterey, CA, USA
  • Print_ISBN
    0-7803-5987-9
  • Type

    conf

  • DOI
    10.1109/OVE:EC.2000.847520
  • Filename
    847520