Fluxless die bonding of high power laser bars using the AuSn-metallurgy

Author

Weiß, Stefan ; Bader, Volker ; Azdasht, Ghassem ; Kasulke, Paul ; Zakel, Elke ; Reichl, Herbert

Author_Institution

Tech. Univ. Berlin, Germany

fYear

1997

fDate

18-21 May 1997

Firstpage

780

Lastpage

787

Abstract

This paper presents a new concept for a fluxless package design for commercial high power laser bars. The laser bars are soldered on CuW heatsinks using Au(80)Sn(20) solder. Then a Cu lead is bonded with the FPC method (Fiber-Push-Connection) as a cap and electrical contact. Finally, the heatsink is mounted on a Cu microchannel cooler with Pb(37)Sn(63). We describe the mounting processes in detail, showing the large bonding window for soldering with Au(80)Sn(20), which is necessary for industrial production. The metallurgy of the Au(80)Sn(20) bonding interface is not dependent on the bond parameters in the area of the bonding window. Electro-optical characterizations show excellent performance of the laser bars. An accelerated aging test gives a first indicator of the high reliability of this package concept

Keywords

cooling; gold alloys; heat sinks; life testing; microassembling; semiconductor device packaging; semiconductor device reliability; semiconductor lasers; soldering; tin alloys; Au(80)Sn(20) solder; AuSn; AuSn metallurgy; Cu; Cu lead bonding; Cu microchannel cooler; CuW heatsinks; Pb(37)Sn(63); PbSn; accelerated aging test; electro-optical characterizations; fiber push connection method; fluxless die bonding; fluxless package design; high power laser bars; high reliability; industrial production; Bars; Bonding; Fiber lasers; Flexible printed circuits; Heat sinks; Lead; Microassembly; Optical design; Packaging; Power lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1997. Proceedings., 47th

Conference_Location

San Jose, CA

ISSN

0569-5503

Print_ISBN

0-7803-3857-X

Type

conf

DOI

10.1109/ECTC.1997.606259

Filename

606259