• DocumentCode
    2091309
  • Title

    Low-cost intracortical spiking recordings compression with classification abilities for implanted BMI devices

  • Author

    Coppa, B. ; Heliot, R. ; Michel, Olivier ; Moisan, E. ; David, David

  • Author_Institution
    CEA-LETI, Grenoble, France
  • fYear
    2012
  • fDate
    Aug. 28 2012-Sept. 1 2012
  • Firstpage
    2623
  • Lastpage
    2626
  • Abstract
    Within Brain-Machine Interface systems, cortically implanted microelectrode arrays and associated hardware have a low power budget for data sampling, processing and transmission. It is already possible to reduce neural data rates by on-site spike detection; we propose a method to further compress spiking data at a low computational cost, with the objective of maintaining clustering and classification abilities. The method relies on random binary vector projections, and simulations show that it is possible to achieve a compression ratio of 5 at virtually no cost in terms of classification errors.
  • Keywords
    biomedical electrodes; brain-computer interfaces; data compression; handicapped aids; medical signal processing; neurophysiology; prosthetics; signal classification; BMI systems; brain-machine interface; classification abilities; classification ability; clustering ability; cortically implanted microelectrode arrays; data processing; data sampling; data transmission; implanted BMI devices; low cost intracortical spiking recording compression; power budget; random binary vector projections; spiking data compression; Clustering algorithms; Compressed sensing; Computational efficiency; Hardware; Real-time systems; Shape; Vectors; Compressive Sensing; Neural signal clustering; Random embeddings; Action Potentials; Algorithms; Brain-Computer Interfaces; Cerebral Cortex; Humans; Microelectrodes; Principal Component Analysis; Prostheses and Implants;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE
  • Conference_Location
    San Diego, CA
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-4119-8
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2012.6346502
  • Filename
    6346502