DocumentCode
20925
Title
A Flexible 0.18
BiCMOS Technology Suitable for Various Applications
Author
Hashimoto, Toshikazu ; Nonaka, Yosuke ; Tominari, T. ; Fujiwara, Toshihito ; Udo, Tsutomu ; Satoh, H. ; Watanabe, K. ; Jimbo, Toshihiko ; Shimamoto, H. ; Isomura, Satoru
Author_Institution
Micro Device Div., Hitachi Ltd., Tokyo, Japan
Volume
1
Issue
11
fYear
2013
fDate
Nov. 2013
Firstpage
181
Lastpage
190
Abstract
Hitachi´s SiGe BiCMOS technology, which integrates 0.18 μm CMOS and a SiGe heterojunction bipolar transistor (HBT), does not degrade MOS or bipolar performance. The BiCMOS process is divided into blocks, and the ordering of their processing is optimized so that they do not interfere with each other. Low-thermal-budget SiGe HBT formation is achieved using a minimal-moisture-desorption oxide layer, thereby avoiding disturbing the CMOS process. This technology, which can also be applied to the 0.13 μm generation, has been used for applications ranging from high-speed ones like automotive radar and 40 Gbps optical communication to consumer ones like wireless.
Keywords
BiCMOS integrated circuits; Ge-Si alloys; heterojunction bipolar transistors; optical communication; planarisation; road vehicle radar; BiCMOS technology; SiGe; automotive radar; bit rate 40 Gbit/s; heterojunction bipolar transistor; low-thermal-budget HBT formation; minimal moisture desorption oxide layer; optical communication; size 0.13 mum; size 0.18 mum; BiCMOS integrated circuits; Bipolar transistors; CMOS integrated circuits; CMOS technology; Heterojunction bipolar transistors; Logic gates; Silicon germanium; BiCMOS; Bipolar transistor; SiGe heterojunction bipolar transistor (HBT); hydrogen termination;
fLanguage
English
Journal_Title
Electron Devices Society, IEEE Journal of the
Publisher
ieee
ISSN
2168-6734
Type
jour
DOI
10.1109/JEDS.2013.2294202
Filename
6681899
Link To Document