A unique approach for bare die testing which utilizes Au-stud-bumping technology and TAB technology

A unique approach for bare die testing is introduced which utilizes the combination of the Au-stud-bumping technology on a die pad and the TAB technology commonly used for packaging. The proposed technique here bumps Au stud bumps on Al bonding pads on a die using the common wire-bonding technology and makes contact between the Au stud bumps and the Au-plated terminals formed on the TAB film. The Au-to-Au touch can attain the small and stable contact resistance between them. The prototype bare die carrier of this approach has been completed and the result of the first-stage evaluation is described