DocumentCode
2096355
Title
The Numerical Simulation and Experiment Study on the Coupled Thermal Conduction and Groundwater Advection Heat Transfer Process under the Intermittent Operation of the Ground-Coupled Heat Pump System
Author
Li, Sufen ; Shang, Yan
Author_Institution
Sch. of Energy & Power Eng., Dalian Univ. of Technol., Dalian, China
fYear
2010
fDate
28-31 March 2010
Firstpage
1
Lastpage
5
Abstract
The three-dimension coupled thermal conduction and groundwater advection unsteady state heat transfer model in this paper is developed according to the heat-transfer process between the vertical U tube underground and its ambient soil. The feasibility of this model is verified by intermittent experiment of ground source heat pump in winter. In the model, boundary layer is replaced by velocity equation in inlet boundary condition based on the saturated soil and groundwater in order to be more close to the actual. The the soil recovery temperature influenced by the thermal conductivity and environmental element (the temperature of the air, solar radiation energy, velocity of wind) in the intermittent operation is studied in this paper. The result has guiding significance to the intermittent operation of the ground source heat pump.
Keywords
air; groundwater; heat conduction; heat pumps; numerical analysis; pipe flow; soil; solar radiation; thermal conductivity; wind; air temperature; environmental element; ground coupled heat pump system; groundwater advection heat transfer process; inlet boundary condition; intermittent operation; numerical simulation; saturated soil recovery; solar radiation energy; thermal conduction; thermal conductivity; velocity equation; wind velocity; Boundary conditions; Equations; Heat pumps; Heat transfer; Land surface temperature; Numerical simulation; Soil; Solar radiation; Thermal conductivity; Wind energy;
fLanguage
English
Publisher
ieee
Conference_Titel
Power and Energy Engineering Conference (APPEEC), 2010 Asia-Pacific
Conference_Location
Chengdu
Print_ISBN
978-1-4244-4812-8
Electronic_ISBN
978-1-4244-4813-5
Type
conf
DOI
10.1109/APPEEC.2010.5448541
Filename
5448541
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