DocumentCode
2101623
Title
Influence of the mounting configuration on the transient thermal behavior of high power laser diode arrays
Author
Puchert, R. ; Bärwolff, A. ; Voss, M. ; Menzei, U. ; Tomm, J.W. ; Luft, J.
Author_Institution
Max-Born-Inst., Berlin, Germany
fYear
1997
fDate
18-21 May 1997
Firstpage
1254
Lastpage
1259
Abstract
Operation parameters of high power laser diodes such as emission wavelength, threshold current, optical output power and lifetime depend sensitively on the temperature of the active region. For many applications, knowledge about the temporal evolution of the temperature of active region is necessary to optimize the operating conditions. This paper describes experimental and theoretical work on the influence of different mounting configurations on the temperature transients in the active regions of high power laser diodes. We investigate the transient thermal behavior in a range between 10 ns and CW operation. In this range the modeling is verified by excellent agreement of experimental data and theory
Keywords
finite element analysis; quantum well lasers; semiconductor device models; semiconductor device packaging; semiconductor laser arrays; thermal analysis; transient analysis; active region temperature; high power laser diode arrays; modeling; mounting configuration; temperature transients; transient thermal behavior; Diode lasers; Optical arrays; Optical pumping; Optimized production technology; Packaging; Semiconductor laser arrays; Silicon compounds; Stimulated emission; Temperature sensors; Threshold current;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location
San Jose, CA
ISSN
0569-5503
Print_ISBN
0-7803-3857-X
Type
conf
DOI
10.1109/ECTC.1997.606336
Filename
606336
Link To Document