DocumentCode
2103571
Title
Isothermal em as highly accelerated test method for copper damascene lines
Author
Kin Leong ; Yap Andrew ; Bee Hoon Lim ; Eng Chye Chua ; Yeow Kheng Lim ; Suat Cheng ; Khoo Sherry
Author_Institution
Chartered Semiconductor Manufacturing
fYear
2002
fDate
12-12 July 2002
Firstpage
129
Lastpage
134
Keywords
Circuit testing; Copper; Electromigration; Integrated circuit interconnections; Isothermal processes; Life estimation; Packaging; Semiconductor device testing; Temperature; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2002. IPFA 2002. Proceedings of the 9th International Symposium on the
Conference_Location
Singapore
Print_ISBN
0-7803-7416-9
Type
conf
DOI
10.1109/IPFA.2002.1025631
Filename
1025631
Link To Document